Ceramic electronic component
US8570708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2012 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Jun 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/38
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.