Enclosure of an electronic device
US8570742B2 · kind B2 · utility
4Cited by
22References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 3, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Mar 9, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An enclosure includes a case and a cover. The case includes a heat generating device and a bracket mounted therein. The bracket defines an engaging hole. A heat dissipating module is located in the engaging hole and contacts the heat generating device. The cover includes a number of mounting poles pivotally mounted thereon. The cover is mounted on the case. The mounting poles are engaged on the bracket to enclose the heat dissipating module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.