Cold plate having blades that interleave with memory modules
US8570744B2 · kind B2 · utility
36Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2009 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Dec 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.