Multilayer backing absorber for ultrasonic transducer
US8570837B2 · kind B2 · utility
76Cited by
10References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A multilayer backing absorber for use with an ultrasonic transducer comprises an elemental multilayer having at least one metal layer and at least one adhesive layer, wherein the backing absorber is adapted to be coupled to a vibrating layer of the ultrasonic transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.