Wireless communication device and HAC module thereof
US8571246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2011 |
| Grant date | Oct 29, 2013 |
| Priority date | — |
| Expiry date | Jan 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2225/49
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An exemplary hearing aid compatibility (HAC) module includes an insulative substrate and a ground member. The substrate includes a first mounting surface, and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface. The ground member includes two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface. The connecting portion comprises two or more parts. One of the parts connects one of the ground portions, and another of the parts connects the other ground portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.