Methods for fabricating high temperature electromagnetic coil assemblies
US8572838B2 · kind B2 · utility
6Cited by
87References
16Claims
0Family size
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Key dates
| Filing date | Mar 2, 2011 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Mar 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.