Arrangement for reflection of heat radiation, process of making same and uses of same
US8573194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2009 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jul 30, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C17/3686
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The heat reflecting arrangement with an improved high heat resistance, e.g. 100 hours at 500° C., includes a substrate, a heat reflecting layer (A) on at least one side of the substrate, which contains indium tin oxide (ITO), and a barrier layer (B) that covers the heat reflecting layer (A), which contains a metal oxide and/or a metal nitride. A fireplace or baking oven with a viewing window having this layer system with the heat reflecting layer is also described. In addition a process for providing the heat reflecting arrangement is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.