Micro-architected materials for heat exchanger applications
US8573289B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2009 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jun 22, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A Heat Exchanger comprising a three-dimensional ordered microstructure material within a shell. The three-dimensional ordered microstructure material has dimensions that allow for large surface area to volume ratios, between 300 and 15000 m2/m3. Alternatively the three-dimensional ordered microstructure may have an open volume fraction between 0.4 and 0.6. The three-dimensional ordered microstructure may be comprised of hollow truss elements and partially filled with a thermally conductive material or a fluid. The Heat Exchanger has a heat transfer coefficient multiplied by the surface area to volume ratio between 3.7*107 and 7*109 Watts per M3K.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.