Dissipative structures and related methods
US8573571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2010 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Mar 18, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F9/30
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Dissipative structures include at least one panel and a cell structure disposed adjacent to the at least one panel having interconnected cells. A deformable material, which may comprise at least one hydrogel, is disposed within at least one interconnected cell proximate to the at least one panel. Dissipative structures may also include a cell structure having interconnected cells formed by wall elements. The wall elements may include a mesh formed by overlapping fibers having apertures formed therebetween. The apertures may form passageways between the interconnected cells. Methods of dissipating a force include disposing at least one hydrogel in a cell structure proximate to at least one panel, applying a force to the at least one panel, and forcing at least a portion of the at least one hydrogel through apertures formed in the cell structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.