Security feature and method for manufacturing the same
US8573650B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2008 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Nov 20, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/28
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a security feature for a security element, a security paper or a data carrier that exhibits a substrate into which at least one through opening and at least one marking in registration with the through opening are to be introduced. The method includes the steps of providing a substrate with a laser-modifiable marking substance at least in the region of the marking to be produced and, in the same operation, introducing at least one through opening into the substrate by the action of laser radiation at higher laser power and modifying the laser-modifiable marking substance in the marking region by the action of laser radiation at a lower laser power to produce at least one marking in registration with the through opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.