Wide-array inkjet printhead assembly
US8573739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2010 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Aug 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A wide-array inkjet printhead assembly with die carriers includes a backbone which delivers fluid through a manifold with a number of openings. The openings are spaced apart according to a opening pitch. A plurality of inkjet die includes trenches with a trench pitch which is smaller than the opening pitch. A plurality of die carriers include a plurality of oblique tapered channels, with one end of the oblique tapered channels having pitch matching the opening pitch and interfacing with the backbone and the opposite end of the oblique tapered channels having a pitch matching the trench pitch and interfacing with the inkjet die. A method for assembling a wide-array inkjet printhead assembly is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.