Method for preparing a moisture curable hot melt adhesive
US8574394B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Apr 8, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Moisture curable reactive hot melt adhesive compositions are prepared using a novel two-step polymerization process. Resulting adhesives have improved green strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.