Process and apparatus for molding a shingle, for cooling a shingle, for applying a curvature thereto and carrier plate for facilitating the process
US8574481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2007 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jun 20, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/108
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Shingle material, preferably comprising a core with a capstock applied thereto is extruded, preferably by means of a co-extrusion process, onto a series of individual carrier plates, with the shingle material then being severed such that each carrier plate carries its own layer of shingle material thereon and the carrier plates are then delivered to a compression mold, in which the shingle is molded. The carrier plate and shingle is then removed from the mold and carried through a series of hold-down stations, after which the shingle is delivered to a trimmer, where flashing is simultaneously trimmed from its edges. The shingle is then cooled, preferably by sandwiching it between upper and lower retention members, which are cooled via a cooling tower. The retention members impart a curvature to the shingle. The carrier plates are returned via a return conveyor, to be heated, for re-use. Each carrier plate is preferably configured to have a reciprocal surface configuration for the under side of a shingle for providing a surface mold therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.