Patent · US Active

Heat sink having a high thermal conductivity

US8575051B2 · kind B2 · utility

2Cited by

7References

14Claims

0Family size

Assignee

Plansee SE · AT

Inventor

Arndt Lüdtke · Reutte, AT

Key dates

Filing date	Jan 20, 2004
Grant date	Nov 5, 2013
Priority date	—
Expiry date	Feb 15, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

The invention relates to a heat sink comprising a diamond-containing composite material. In addition to a diamond content of 40-90% by volume, the composite material further comprises from 0.005 to 12% by volume of a silicon-carbon compound, from 7 to 49% by volume of an Ag-, Au- or Al-rich phase and less than 5% by volume of a further phase, with the volume ratio of the Ag-, Au or Al-rich phase to silicon carbide being greater than 4 and at least 60% of the diamond surface being covered by the silicon-carbon compound. Preferred production processes include atmospheric pressure and pressure-aided infiltration techniques. The component is suitable, in particular, as heat sink for semiconductor components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.