Method of marking or inscribing a workpiece
US8575511B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2009 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jun 19, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method of marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed in the vicinity of the workpiece (3) in such a way that the radiation passes through the workpiece (3) before it impinges on the polymer matrix (7), characterized in that disposed between the polymer matrix (7) and the workpiece (3) is a film (15) of liquid which is in contact with the polymer matrix (7) and with the workpiece (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.