Chip-scale infrared emitter package
US8575578B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2013 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Mar 7, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/3504
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.