RFID transponder, in particular for assembly on metal and manufacturing method therefor

US8576124B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Alexander Popugaev · Erlangen, DE
• Ralner Wansch · Geiselhöring, DE
• Josef Bernhard · Nabburg, DE
• Alexander Pflaum · Erlangen, DE

Key dates

• Filing date: May 28, 2010
• Grant date: Nov 5, 2013
• Expiry date: Jul 11, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49002
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

An RFID transponder including an antenna, a chip having at least one transmission and reception circuit as well as a memory, a dielectric carrier element which is covered on a first surface with a structured first metallization and which is covered on a second surface disposed opposite the first surface with a second metallization. The first and second metallizations are mutually electrically conductively connected, thereby forming the antenna. The first metallization is structured such that it forms two electric terminals of the antenna arranged on the first surface of the dielectric carrier element. The chip can be or is electrically contacted via these two terminals. An adaptation network is at least partly formed by the structuring of the first metallization and adapting the input impedance of the antenna in a conjugate complex manner to the impedance of the chip.