Manufacturing processes of backplane for segment displays
US8576162B2 · kind B2 · utility
30Cited by
28References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2006 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Dec 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0959
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to design and processes for the manufacture of backplane for segment displays. The process comprises: a) forming conductive lines on a non-conductive substrate layer; b) covering the conductive lines with a photoimageable material; c) forming conductive areas connected to the conductive lines and embedded in the photoimageable material; d) plating a conductive material over the photoimageable material to form segment electrodes; and e) optionally filling gaps between said segment electrodes with a thermal or radiation curable material followed by hardening said thermal or radiation curable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.