Semiconductor device and display apparatus
US8576567B2 · kind B2 · utility
2Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2009 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Dec 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0969
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which deformation and disconnection of wiring are prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.