User interface for modeling thermal comfort
US8577650B2 · kind B2 · utility
2Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2008 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Sep 17, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Predicting thermal strain and providing a visual representation of the predicted thermal strain on a subject. A computerized model combines subject data, fabric data, and environmental conditions to simulate the thermal comfort of the subject wearing a plurality of fabric layers over time. The visual representation indicates the simulated thermal comfort on an image of the subject with the plurality of fabric layers. A user interface enables a user to modify or define the input data to compare the predicted thermal comfort of the subject wearing different garments under the same working conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.