Format conversion from value change dump (VCD) to universal verification methodology (UVM)
US8578309B2 · kind B2 · utility
2Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2012 |
| Grant date | Nov 5, 2013 |
| Priority date | — |
| Expiry date | Jan 31, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/261
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method is disclosed for functional verification and/or simulation of dies in a multi-die 3D ICs. The system and method include converting an I/O trace, embodied as a Value Change Dump, to one or more Universal Verification Methodology objects. This conversion aids in identify and fixing issues contained in die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.