Method of depositing materials on a non-planar surface
US8580037B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2009 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02631
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of depositing materials on a non-planar surface is disclosed. The method is effectuated by rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a method effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.