Plastic bonding method
US8580069B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Nov 8, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
To provide a method of bonding two materials directly with each other, at least one of which is made of a plastic material, which method is applicable to bonding two materials, with no need to use any bonding agent and without allowing the materials to be exposed to high temperature and/or high pressures. In this method in which a first member made of a plastic material and a second member are bonded together, one surface of the first member to be bonded with the second member is irradiated with energy rays having a quantity of energies not lower than 4 eV, followed by directly bonding the first and second members together without any bonding agent being used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.