Patent · US Active

Method for manufacturing a circuit board structure

US8581109B2 · kind B2 · utility

7Cited by

59References

19Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Antti Iihola · Helsinki, FI
Petteri Palm · Regensburg, DE

Key dates

Filing date	Jun 15, 2006
Grant date	Nov 12, 2013
Priority date	—
Expiry date	Mar 22, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4913
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and at least some conductor material of the conductor layer is removed from outside the conductor pattern.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.