Thermal spray method and apparatus using plasma transferred wire arc
US8581138B2 · kind B2 · utility
6Cited by
11References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 22, 2011 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Dec 22, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B7/224
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of thermally depositing metal onto a target surface using a plasma transferred wire arc thermal spray apparatus, wherein the method includes the steps of offsetting the central axis of a consumable wire with respect to an axial centerline of a constricting orifice; and establishing and operating a plasma transferred wire arc between a cathode and a free end of the consumable wire; and melting and atomizing a continually fed free end of the consumable wire into molten metal particles and projecting the particles onto said target surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.