Patent · US Active

Package comprising an electrical circuit

US8581357B2 · kind B2 · utility

1Cited by

11References

18Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Holger Vogt · Mülheim, DE
Jochen Bauer · Gettorf, DE

Key dates

Filing date	Apr 24, 2007
Grant date	Nov 12, 2013
Priority date	—
Expiry date	Dec 3, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/184
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A package including an electrical circuit may be produced in a more efficient manner when on a substrate including a plurality of electrical circuits the circuits are tested for their functionality and when the functional circuits are connected, by means of a frame enclosing the circuit on the surface of the substrate, to a second substrate whose surface area is smaller than that of the first substrate. The substrates are connected, by means of a second frame, which is adapted to the first frame and is located on the surface of the second substrate, such that the first and second frames lie one on top of the other. Subsequently, the functional packaged circuits may be singulated in a technologically simple manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.