Semiconductor device comprising an electromagnetic waveguide
US8581412B2 · kind B2 · utility
1Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2010 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/107
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.