Ultrasonic probe and manufacturing method thereof
US8581472B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2011 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Feb 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/088
Abstract
A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.