Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics
US8582297B2 · kind B2 · utility
4Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2011 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jan 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.