Modular electronics housing

US8582311B2 · kind B2 · utility

Assignee

• Weidmüller Interface GmbH & Co. KG and PH · DE

Inventors

• Bernd Van Giesen · Detmold, DE
• Dirk Hanke · Lemgo, DE
• Peter Stuckmann · Lage, DE
• Stephan Lange · St. Leon-Rot, DE
• Matthias Niggemann · Dörentrup, DE
• Georg Wagner · Chieming, DE
• Jens Brokmann · Detmold, DE
• Katrin Wibbeke · Paderborn, DE
• Heinz Scharlibbe · Porta Westfalica, DE
• Andreas Wedler · Detmold, DE

Key dates

• Filing date: Feb 3, 2010
• Grant date: Nov 12, 2013
• Expiry date: Sep 26, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01R24/64
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend outwardly beyond the corresponding vertical edges of the housing side walls, respectively. Vertical side members having generally U-shaped horizontal cross-sectional configurations are mounted on the outwardly extending edge portions of the printed circuit board, respectively, with the leg portions of each side member extending between the housing side walls and the printed circuit board, respectively, whereby portions of housing side walls overlap the side member leg portions. The upper end of the chamber is closed by a lid member that is fastened between the upper ends of the side members.