Method for manufacturing multilayer ceramic substrate and composite sheet
US8585842B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2009 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.