Heat-resistant structural epoxy resins
US8585861B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2012 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jan 7, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.