Thermal treatment of an implantable medical device
US8586125B2 · kind B2 · utility
36Cited by
104References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2010 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Mar 13, 2031 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2420/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of manufacturing an implantable medical device, such as a drug eluting stent, is disclosed. The method includes subjecting an implantable medical device that includes a polymer to a thermal condition. The thermal condition can result in reduction of the rate of release of an active agent from the device subsequent to the implantation of the device and/or improve the mechanical properties of a polymeric coating on the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.