Method for the precision processing of substrates

US8586402B2 · kind B2 · utility

Assignees

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE
• Albert-Ludwigs-Universitaet Freiburg · DE

Inventors

• Kuno Mayer · Frankfurt am Main, DE
• Monica Aleman · Brussels, BE
• Daniel Kray · Glückstadt, DE
• Stefan Glunz · Glückstadt, DE
• Ansgar Mette · Leipzig, DE
• Ralf Preu · Glückstadt, DE
• Andreas Grohe · Glückstadt, DE

Key dates

• Filing date: Mar 6, 2008
• Grant date: Nov 19, 2013
• Expiry date: Aug 14, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31111
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a method for the precision processing of substrates, in particular for the microstructuring of thin layers, local dopant introduction and also local application of a metal nucleation layer in which a liquid-assisted laser, i.e. laser irradiation of a substrate which is covered in the regions to be processed by a suitable reactive liquid, is implemented.