Method of mounting electronic component and mounting substrate
US8586467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2010 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jul 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.