Dielectric paste composition, method of forming dielectric layer, dielectric layer, and device including the dielectric layer
US8586660B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Mar 3, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Nov 10, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/02
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A dielectric paste composition including: a plurality of inorganic dielectric particles, a binder, a solvent, and a halogenated hydrocarbon. Also disclosed is a method of forming a dielectric layer, a dielectric layer, and a device including the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.