Filled polyamide molding materials
US8586662B2 · kind B2 · utility
24Cited by
70References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2008 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Nov 12, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/29
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to filled polyamide molding compounds which, in addition to a selected polymer mixture comprising two different polyamides, contain long glass fibers with a non-circular cross-sectional area. Furthermore, the invention relates to the use of such molding compounds for the production of molded articles and the molded articles themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.