Curing compositions having low-free amounts of methylenedianiline
US8586682B2 · kind B2 · utility
1Cited by
14References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2010 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Aug 27, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curing composition of a coordination complex comprising methylenedianiline (MDA) and a salt, and less than 1000 of free MDA. The curing composition may be used in curing polyurethanes and epoxy resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.