Patent · US Active

Combined diode, lead assembly incorporating an expansion joint

US8586857B2 · kind B2 · utility

54Cited by
36References
48Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 4, 2008
Grant dateNov 19, 2013
Priority date
Expiry dateJul 8, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.