Interconnect schemes, and materials and methods for producing the same
US8586871B2 · kind B2 · utility
13Cited by
13References
15Claims
0Family size
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Key dates
| Filing date | Jul 19, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jan 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.