Grooved plate for improved solder bonding
US8587019B2 · kind B2 · utility
5Cited by
4References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.