Integrated sensing package structure
US8587103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Nov 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.