Laminated electronic component including water repellant and manufacturing method therefor
US8587923B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2010 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | May 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/2325
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a laminated electronic component includes the steps of preparing a laminated component main body, the component main body including internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes, applying a water repellant on a surface of the metal layer and a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.