Systems structures and materials for electronic device cooling
US8587945B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2012 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Jul 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.