Transceiver and interface for IC package
US8588562B2 · kind B2 · utility
52Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2013 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Feb 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49175
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.