Feedthrough configured for interconnect

US8588916B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Kengo Morioka · San Diego, US
• Arne Knudsen · San Diego, US
• Shingo Satou · Kirishima, JP
• Hidekazu Otomaru · Kyoto, JP
• Hiroshi Makino · Kirishima, JP
• Andrew J. Thom · Maple Grove, US
• Markus W. Reiterer · Plymouth, US
• Gordon O. Munns · Stacy, US
• Thomas P. Miltich · Maple Grove, US
• Joyce K. Yamamoto · Maple Grove, US

Key dates

• Filing date: Aug 2, 2011
• Grant date: Nov 19, 2013
• Expiry date: Aug 2, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49117
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.