Sound attenuating device using an embedded layer for acoustical tuning
US8590669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60R13/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention includes a layered acoustical system for sound attenuation in a vehicle including an external decorative layer; a moldable fiber backer adhesively adhered to a back side of the decorative layer, the moldable fiber backer further including an engineered fiber blend including one or more types of thermoplastic fibers and having a first density; a moldable lofted sound absorber and vibration decoupling layer including being made from another engineered fiber blend including one or more types of thermoplastic fibers and having a second density that is less than the first density of the moldable backer, a top side of the vibration decoupling layer being adhesively adhered to the second side of the moldable fiber backer; and an intermediate layer embedded in a location within the vibration decoupling layer to achieve a balance point between transmission loss and sound absorption.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.