Circumferential full thickness resectioning device
US8590764B2 · kind B2 · utility
1,267Cited by
22References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2003 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Jan 12, 2029 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2017/1157
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An apparatus for performing endoluminal anastomosis of an organ comprises an operative head including an endoscope receiving lumen for slidably receiving a flexible endoscope therein, the operative head including an annular tissue receiving space extending around a circumference of a distal end thereof and a stapling mechanism for firing staples around an entire circumference of the tissue receiving space and a tissue gripping mechanism for drawing into the tissue receiving space a portion of tissue extending around an entire circumference of the organ.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.