Soldering apparatus
US8590765B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2011 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Apr 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/044
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder drawing member (402) is detachably attached on the outer side of a jet nozzle (303) that jets molten solder pumped from a solder tank (102) storing the molten solder. The solder drawing member (402) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle (303). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member (402), thereby reducing bridge phenomena and icicle phenomena.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.