Patent · US Active

Plating catalyst and method

US8591637B2 · kind B2 · utility

4Cited by
12References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 14, 2010
Grant dateNov 26, 2013
Priority date
Expiry dateNov 27, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/0716
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.